Call for Papers ( PDF )
Sponsored by

The International Association for Computers and Communications (IACC)

US National Science Foundation (NSF)

In cooperation with

Xidian University, China
The Ohio State University, USA

New Updates


The conference provides a forum for engineers and scientists in academia, industry and government to present their latest research findings in any aspects of parallel and distributed computing. Topics of interest include, but are not limited to:

Architecture                          O.S.& Resource Management
Algorithms & Application              Peer-to-Peer Technologies

Cluster Computing                     Performance Evaluation
Compilers and Languages               Software Systems and Tools

Data0intensive and I/O Computing      High-end Systems and Computing

Network-based/Grid Computing          Wireless & Mobile Computing

Paper Submission

Form of Manuscript: Not to exceed 20 double-spaced, 8.5 x 11-inch pages (including figures, tables and references) in 10-12 point font. Number each page. Include an abstract, five to ten keywords, the technical area(s) most relevant to your paper, and the corresponding author's e-mail address. Submissions should represent original, substantive research results. We will not accept any paper which, at the time of submission, is under review for or has already been published (or accepted) for publication in another conference or journal venue.

Electronic Submission:
Web-based submissions only.

Conference Timeline

Paper Submisison:                     February 17, 2007 ( Extended to March 5, 2007, 11:59PM PST)

Author Notification:                      May 7, 2007

Final Manuscript Due:                  June 15, 2007


Workshops will be held on September 10 and 14. Workshop proposals should be submitted to the Workshops Co-Chairs, M. Takizawa ( and A. M. Tjoa (, by November 10, 2006.


Proceedings of the conference and workshops will be published by the IEEE Computer Society in CDs only, and will be available at the conference.

For Further Information
- please contact:

Professor Ten H. Lai, Ohio State University,
Professor Chengke Wu, Xidian University,
Professor Jiandong Li, Xidian University,
Professor Xiaodong Zhang,, Ohio State University,